Photoresist Removers

Photoresist Removers

Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

Posistrip® Removers

EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.

EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.

EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.

Universal Removers

EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.

EKC944™ is designed for use at elevated temperatures for hard-to-remove photoresist layers. Used with a solvent rinse, this product will remove harshly treated photoresist providing extremely clean surfaces as demonstrated by low CV shift.

Negative Removers

EKC1020™ is designed to be compatible with sensitive metals where corrosion is a concern. 


  • Post-Etch Residue Removers

    Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

  • Removers for LED Fabrication

    Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.

  • WLP Photoresist Removers & TSV Cleaners

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.

  • Post Clean Treatments

    Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

  • Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.