Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.
EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.
EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.
EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.
EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.
EKC944™ is designed for use at elevated temperatures for hard-to-remove photoresist layers. Used with a solvent rinse, this product will remove harshly treated photoresist providing extremely clean surfaces as demonstrated by low CV shift.
EKC1020™ is designed to be compatible with sensitive metals where corrosion is a concern.
Product Data Sheets (4)
- EKC800™ Series Positive Photoresist Removers (PDF)
- EKC900™ Series Positive & Negative Photoresist Removers (PDF)
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Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
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