DUPONT PRODUCTS & SERVICES
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.