Post-CMP Cleaners

Post-CMP Cleaners

Chemical mechanical planarization (CMP) is a critical enabling technology in advanced integrated circuit manufacturing.

Defects and residues either deposited or formed during the planarization process that can adversely affect product yield are subsequently removed in the post-CMP cleaning step.  Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

DuPont™ EKC™ PCMP5600 Series post-CMP copper interconnect cleaner
DuPont™ EKC™ PCMP5600 Series is a high volume, post-CMP copper interconnect cleaner required in the manufacturing of advanced semiconductor devices. It features high pH formulations for Cu BEOL and can be used with various barrier slurries.

It offers the following capabilities:

  • Excellent particle removal capability
  • Advanced barrier metals and dielectric compatibility, including Co, and Ru
  • Compatible with ULK dielectrics
  • Improved Cu static etch and lower surface roughness 
  • Contains Copper Oxidation Barrier (COB) functionality 
  • Excellent capability to remove BTA and other organics 
  • TMAH free 
  • Enhanced COO with high dilution design

Copper PCMP Cleaning

EKC PCMP5610™/ PCMP5620™ offers a manufacturing-proven, low cost-of-ownership copper post CMP cleaner featuring a alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films; and can be used with advanced barrier films with excellent corrosion resistance. EKC PCMP5610™/ PCMP5620™ offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules

EKC PCMP5615™ is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post CMP cleaner featuring a alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films;  compatible with Co, and Ru applications,  prevents the formation of circular ring defects .EKC PCMP5615™ offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules

EKC PCMP5630™ is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post CMP cleaner featuring a alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films;  Excellent organic residue removal capability, prevents the formation of circular ring defects.  EKC PCMP5630™ offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules

Product Information

RELATED DUPONT PRODUCTS & SERVICES

  • Post-Etch Residue Removers

    Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

  • Photoresist Removers

    Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

  • Removers for LED Fabrication

    Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.

  • WLP Photoresist Removers & TSV Cleaners

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.

  • Post Clean Treatments

    Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

INFORMATION & IDEAS

  • Copper PCMP Cleaning Applications

    This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces and more.