WLP Series dry film photoresist

High Performance and High Resolution Multi-Purpose Dry Film Photoresist

WLP 1000 Series dry film photoresists are high resolution, multi-purpose films compatible with copper pillar plating and solder bump plating, both lead-free and eutectic. These films are available in 10, 15, 20, and 30 micron thicknesses.

Features:

  • High resolution for fine pitch electro plating process
  • High chemical resistance for silver plating, ENIG and ENEPIG
  • No damage for active metal even through RIE process 
  • Na2CO3 and TMAH developable
  • Fast and totally dissolved stripping mode

Benefits:

  • Capability for finer pitch work than alternative products
  • Improved plating performance
  • Higher development productivity when using TMAH
  • Cleaner stripping

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