- Thermal designs requiring thin bondlines
- Interface for heat sinks or heat spreaders
DuPont™ Temprion™ TG0510 is a non-silicone thermal grease designed to eliminate the outgassing of low molecular weight siloxane contamination the surrounding components in an electronic device. The rheology of the grease was optimized to enable easy application via dispensing and screen printing systems. Thin bondlines can be achieved to minimize the thermal resistance of the application. The formulation was also optimized to withstand thermal cycling conditions.