Interconnect Solutions

USES AND APPLICATIONS

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Electronic Materials for Antennas

Electronic Materials for Antennas

DuPont materials are used to create antennas on a wide range of substrates, for applications including RFID, various UHF applications, and high-frequency applications up to and exceeding 100 GHz.

Embedded Passive Component Materials

Embedded Passive Component Materials

Electronic components made with products from DuPont provide superior performance, functionality, and reliability over time while allowing for the smaller footprint that electronics manufacturers demand.

High Frequency RF & mm Wave Applications

High Frequency RF & mm Wave Applications

The DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) material system delivers the best performance and cost for MCM-C packaging solutions in RF and mm wave applications, thanks to high levels of integration and reliability.

Material Solutions for Telecommunications

Material Solutions for Telecommunications

DuPont material solutions solve some of the toughest challenges in telecommunications, including applications for wireless infrastructure, radio frequency and high power

Thermal Management for Electronics

Thermal Management for Electronics

DuPont offers thermally conductive materials which exhibit exceptional reliability under extreme temperatures as well as electronic inks that can print directly to a variety of conductive substrates.

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