Solamet® PV Aluminum Metallization Pastes for Local Back Surface Field Solar Cell Designs
To help lower LCOE DuPont is actively engaged in the development of Solamet® metallization pastes for new cell architectures that can deliver >22% cell efficiency.
DuPont™ Solamet® PV36x series photovoltaic metallization pastes enable lower laydown of less than 1 g per 6” x 6” wafer and up to 0.8 percent greater efficiency with LBSF cell designs. They are high performance conductive aluminum compositions, developed as a back surface conductor compatible with the i-PERC process for Local Back Surface Field (Local BSF) designs of silicon solar cells.
DuPont offers two new products as part of the series:
• DuPont™ Solamet® PV361 is designed for laser fired local contact formation.
• DuPont™ Solamet® PV362 is optimized for i-PERC process for Local BSF designs
Additional product benefits include:
• Very good local BSF formation with minimum voiding
• High adhesion on passivation layer (SiO2/SiNx, Al2O3/SiNx stacks) with no dielectric damage
• Fast drying and firing
• Low electrical resistivity after firing
Additional Information (2)
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