High-Efficiency Metal Wrap Through Technology for Silicon Solar Cells
The newest series of Metal Wrap Through (MWT) technology for high–efficiency rear side interconnected silicon solar cell designs.
- Specifically developed to provide up to 0.4% greater efficiency in MWT solar cell designs versus standard cell designs.
- Solamet® PV701 & PV71x paste is employed as a via paste and p-contact metallization for back side tabbing interconnects.
Key features include:
- Excellent electrical contact to front side silver grid structures
- High mechanical strength
- High shunt resistance
- High line conductivity
- Outstanding solderability as a p-contact metallization
RELATED DUPONT PRODUCTS & SERVICES
Solamet® N-type silver/aluminum frontside metallization pastes
Solamet® silver/aluminum paste for p-type emitters offers fine line printability, low contact resistivity on B-doped emitter layer and more
Solamet® for Passivated Emitter Rear Cell (PERC)
DuPont™ Solamet® PV76x front side silver pastes designed to maximize efficiencies and improve the reliability of solar cells and panels utilizing Passivated Emitter Rear Cell (PERC) technology.
Solamet® Front Side Silver Pastes
Solamet® PV19x pastes offer P-type solar cell and panel manufacturers significant efficiency gains up to and exceeding 0.15 percent when compared to Solamet® PV18x paste, the current industry benchmark.
Solamet® PV Aluminum Pastes
Solamet® conductive aluminum compositions as a back surface conductor compatible with i-PERC for Local Back Surface Field designs of silicon solar cells
Solamet® Rear Side Low Silver Tabbing Metallization Paste
Excellent solderabililty and adhesion, very low consumption, high conductivity, compatible with rear side aluminum metallizations
Solamet® Low Temperature Silver Pastes
Solamet® PV41x series PV pastes are designed for low temperature processing on thin film PV and heterojunction solar cells, both rigid and flexible.