CIRCUPOSIT™ 7900 Electroless Copper for SAP

CIRCUPOSIT™ 7900 Electroless Copper Process has been specifically developed for SAP applications. The new CIRCUPOSIT™ SAP Conditioner provides uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials.

    Key Benefits:
  • Fine deposit grain structure
  • Excellent electroless copper coverage including in microvias
  • Excellent peel strength after HAST & Reflow
  • Uniform thickness
  • Excellent via reliability
  • High migration resistance
  • Excellent bath stability

Fine Grain Structure

Excellent Via
Bottom Coverage

10um L/S after flash etch