Circuposit™ 7900 Electroless Copper Process has been specifically developed for SAP applications. The new Circuposit™ SAP Conditioner provides uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials.
Fine deposit grain structure
Excellent electroless copper coverage including in microvias
Excellent peel strength after HAST & Reflow
Excellent via reliability
High migration resistance
Excellent bath stability
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