COPPER GLEAM™ HGX Electrolytic Copper

COPPER GLEAM™ HGX Copper is a new product specially formulated for Flexible Printed Circuit Boards (FPC). It produces uniform crystal grain structure to provide a smooth plated surface on rolled copper. The 3 component additive system also allows complete control by CVS analytical method.

    Key Benefits:
  • Excellent bright appearance on rolled copper
  • Low internal stress
  • Excellent thickness distribution
  • Improved thermal shock performance

Low Stress

Excellent Bright Apppearance on Rolled Copper

Excellent Throwing Power