EKC Photoresist & Residue Removers

Removers for LED Fabrication

Chemistries for LED Manufacturing

DuPont offers a specific line of wet chemistries for LED manufacturing through our EKC Technology portfolio

The production of LED dies can require a variety of wet chemical treatments, and DuPont has put its science to work in formulating solutions for the LED industry designed to enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.

LED Fabrication Removers Portfolio

EKC162™ Plasma and Photoresist Residue Remover – copper compatible
Formulated to remove the most challenging organic- and plasma-based residues at low operating temperatures. Water-rinsable. Compatible with gallium arsenide (GaAs).

EKC175™ Plasma and Photoresist Residue Remover – aluminum compatible
Provides fast and efficient removal of plasma-basedresidues as photoresist. Water-rinsable.

EKC830™ Positive Tone Photoresist Remover
Photoresist removal product specifically targeted for positive-tone photoresists. Compatible with an exceptionally broad array of metals.

EKC922™ Negative Tone Photoresist Remover
Photoresist removal product specifically targeted for negative-tone photoresists. Compatible with gallium arsenide (GaAs) and an exceptionally broad array of metals.

Photoresist & Residue Removers

  • Removers for LED Fabrication
  • Post-Etch Residue Removers
  • Post-CMP Cleaners
  • Post-Clean Treatments
  • WLP Photoresist Removers & TSV Cleaners
  • Photoresist Removers

Removers for LED Fabrication

Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts

Post-Etch Residue Removers

Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

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Post-CMP Cleaners

Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

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Post-Clean Treatments

Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

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WLP Photoresist Removers & TSV Cleaners

Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing

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Photoresist Removers

Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces

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