CMP Pads

Ikonic™ Polishing Pads

Ikonic™ Polishing Pads

The Ikonic™ pad series for chemical mechanical planzarization (CMP) is a breakthrough pad platform designed for multiple applications and advanced nodes. DuPont’s latest CMP polishing pad technology combines a range of pad hardness and varying levels of porosity with a pad surface that is easy to condition. The Ikonic™ pad platform is designed to reduce wafer defects and improve removal rate, topography and cost of ownership.

  • The Ikonic™ 4100 series of polishing pad targets processes that require higher hardness pads. It is designed to deliver significantly lower defects in the most advanced Logic and Memory technology nodes.

    Benefits:

    • Step-out defectivity performance
    • Improved balance in trade-offs associated with defectivity and removal rate stability over pad-life
    • Easily conditioned pad surface

    Applications:

    • Shallow trench isolation (STI)/Ceria, interlayer dielectric (ILD), Copper bulk, Tungsten

  • The Ikonic™ 4200 series of polishing pad targets processes that require higher hardness pads. It is designed for higher removal rate, which can help reduce cost of ownership for customers by giving higher throughput and/or reducing slurry consumption volume.

    Benefits:

    • Higher removal rate
    • Easily conditioned pad surface

    Applications:

    • STI/Ceria, Tungsten, copper bulk

  • The Ikonic™ 3000 series of polishing pads targets processes that require medium hardness pads. It is designed to deliver step-out improvements in wafer defect levels and improved topography performance when compared to IC1000™ pads.

    Benefits:

    • Improved defectivity performance
    • Improved topography performance
    • Multiple configuration options
    • Long pad lifetime
    • Easily conditioned pad surface

    Applications:

    • Copper bulk

  • The Ikonic™ 2000 series of polishing pads targets processes that require lower hardness pads. It is designed to deliver step-out improvements in wafer defect levels, consistent and stable removal rates, and longer pad lifetime.

    Benefits:

    • Step-out defectivity performance
    • Multiple offerings to meet a range of performance requirements
    • Long pad lifetime
    • Easily conditioned pad surface

    Applications:

    • Copper barrier, buff