Kapton® Polyimide films

Kapton® FPC

Kapton® FPC superior adhesion and low shrinkage polyimide film

DuPont™ Kapton® FPC polyimide film is treated on both sides and has the same excellent balance of physical, chemical and electrical properties over a wide temperature range offered by general purpose Kapton® HN.

Kapton® FPC offers superior dimensional stability and adhesion, and is specifically designed for flex circuit manufacturers. In applications where superior adhesion and low shrinkage are important, Kapton® FPC is the polyimide film of choice.

Applications include:

  • Flexible printed circuits
  • Automotive
  • Computers
  • Consumer products
  • Telecommunications equipment
  • Industrial instrumentation and controls
  • Military applications
  • Aerospace
  • Electronic parts
  • PCB stencils
  • Screen printing
  • Insulation tubing

TYPICAL PROPERTIES OF Kapton® FPC

PROPERTY

1 MIL

2 MIL

3 MIL

5 MIL

Dielectric Strength, V/mil

7.700

6,100

5,200

3,900

Coefficient of Thermal Expansion, ppm/°C

20

20

20

20

Adhesion, pli

10

10

10

10

Dimensional Stability, %

.03

.03

.03

.03

For complete information on Kapton® FPC, view data sheet.