Dow Electronic Materials offers electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance to meet the needs of today’s applications.
PALLADURE™ 200 Palladium
Description: Produces a ductile palladium deposit with low porosity for bonding and solderability.
PALLAMET™ 600 Palladium-Nickel
Description: Produces a bright, ductile palladium-nickel deposit of approximately 80% Pd/20% Ni from a low ammonia sulfate-based (chloride-free) electrolyte, which is completely free of ammonia odor. A stable alloy composition over a wide current density range, provides a cost effective solution for reducing gold thickness.