Passive Devices

Solderon™ SN-2680 Neutral pH Tin

Solderon™ SN-2680 Electrolytic Tin provides a pure tin deposit offering excellent solderability for Passive Devices.

Features

  • Low attack on base ceramic or low-melting point glass due to neutral pH range operation.
  • Excellent solderability.
  • Low propensity for whiskers.
  • No generation of Sn4+ precipitate.
  • Control of product coupling and media aggregation.
  • Use of Flow-Through Platers is achieved due to low foaming formulation when using Solderon™ SN-2680BS
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Surface Morphology by SEM (X 50)

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Forming Test

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Surface Morphology by SEM (X 2,000)

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Solderability Test (After PCT)