Solderon™ ST-300T Matte Tin

Solderon™ ST-300T Matte Tin

DuPont Electronic Solutions offers a complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts.

A single additive matte tin product that offers a wide process operating window and whisker mitigated pure tin deposits

Solutions
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Features & benefits

  • Also suited to low speed rack and barrel applications
  • Control of product coupling and media aggregation.
  • Easy bath control and fully analyzable components
  • Excellent solderability.
  • High plating current density: 5 – 40 ASD
  • Low attack on base ceramic or low-melting point glass due to neutral pH range operation.
  • Low foaming electrolyte: suitable for high speed applications
  • Low propensity for whiskers.
  • No black foam line: suitable for selective plating and full strip plating
  • No generation of Sn4+ precipitate.
  • Use of Flow-Through Platers is achieved due to low foaming formulation when using Solderon™ SN-2680BS
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