Leadframes

Solderon™ ST-300T Matte Tin

Solderon™ ST-300T matte tin electroplating process is the newest innovation from DuPont Chemical in lead-free processes for Integrated Circuit Packages. The Solderon™ ST-300T matte tin process enables high-throughput for maximum cost benefit while delivering exceptional performance.

  • Single additive system, ease of control
  • High current density capability for high throughput in production
  • Low whisker propensity
  • Excellent solderability at lower solder pot temperature
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Solderability after 8 hours steam age, 215°C SnPb SolderPot

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Surface Morophology 5,000X Overview