Surface Treatment for IC Leadframes

 
 
 

DuPont Electronic Solutions offers advanced surface treatment material to reduce silver immersion, minimize epoxy bleed, and to inhibit tin whisker growth.

Silverjet™ Pre-Dip AG201 Silver Anti-Immersion
Description: A sophisticated product provides protection against silver immersion onto copper and copper alloy surface.

Silverjet™ Post-Dip 90 Silver Anti-EBO
Description: A self adhering product that minimizes epoxy bleed problem associated with silver epoxy and die attach on spot plated silver deposits.

Cuprotec™ II Copper Anti-Tarnish
Description: Cuprotec™ II Copper Anti-Tarnish provides a temporary protective film on copper and copper substrates.

Solderguard™ 100 Post-treatment
Description: Solderguard™ 100 Post Treatment provides a temporary protective film on tin and tin-alloy surface for whisker minimization under HTH.

 
 
 
 
 
 

We’re here to help.

We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.

 
 
 
-