Advanced Chip Packaging - Assembly Materials

As the semiconductor industry approaches the limitations of Moore’s law, Dow Electronic Materials recognizes the industry need for innovative material solutions capable of meeting challenges of achieving reliability for large die with low-k and ultra-low-k layers. For that reason, Dow Electronic Materials is developing underfill material solutions - both capillary and wafer-applied - for flipchip and 3D packaging in collaboration with leading industry partners. The new materials are aimed at addressing many of the thermal and mechanical challenges inherent in increased die size and 3D packaging.