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Flexing Our Capabilities for High-Speed, High-Frequency Electronics Applications

June 28, 2019

 
 
 
 
 
 

By Andy Kannurpatti, DuPont Interconnect Solutions

 

Creation, distribution and consumption of data — think artificial intelligence (AI), 5G networks, the internet of things (IoT), Industry 4.0 — is driving growth in high-speed, high-frequency (HSHF) applications in telecommunications, consumer and automotive electronics, as well as flexible displays. Advanced materials manufacturers that focus on these exciting long-term trends will see opportunity in new markets for proven products, as well as in innovation to meet the evolving needs of designers and manufacturers.

The timing to address these needs aligned well with DuPont’s reorganization, which began with the merger between Dow Chemical and DuPont in 2017. Combining renowned advanced electronics materials portfolios from two well-established companies resulted in the formation of the DuPont Electronics and Imaging division, of which DuPont Interconnect Solutions is a line of business. This business aspires to be the leading materials solution partner for advanced interconnects by offering a range of essential high-reliability materials and chemistries.

At the corporate level, in June, following the spin-out of Dow on April 1, the remainder of the company split again into an agricultural enterprise named Corteva, and the specialty products division became the new DuPont.

As the new DuPont, our purpose is to empower the world with essential innovations to thrive. Specifically, in Interconnect Solutions, we are addressing rigid and flex circuit technologies as well as flexible displays with innovations in polyimide films like Kapton®,  and our well-known dielectric and photoresist product lines like Pyralux® and Riston®. We also support circuit manufacturers with our industry-leading chemistry and plating solutions.

Meeting the growing demands of HSHF applications requires significant investment in innovation and close collaboration with our customers. For us, that means building new development and production facilities near rigid and flex circuit designers and manufacturers, as well as original equipment manufacturers (OEMs). We opened our Silicon Valley Technology Center (SVTC) in Sunnyvale, Calif., in 2018 to support this growth. Additionally, we recently announced a $220 million investment to build new production assets in Circleville, Ohio. We continue to invest in our facilities in Taiwan to enable timely delivery of our new innovations.

Recently, I sat down with the editorial team at I-Connect007 to discuss DuPont’s new vision, our production asset investment, and what’s coming next. The interview was published in its entirety in the April 2019 issue of FLEX007 MagazineDownload the article here.

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