For more than 10 years, leading-edge semiconductor manufacturers have relied upon DuPont Electronics & Imaging dual damascene products for achieving semiconductor technology nodes below 20 nm. With proven performance in high-volume manufacturing, our chemistry can achieve void-free bottom-up filling without overburden. What's our secret?
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Dual damascene copper is a class of metallization materials designed to support the dual damascene patterning process, a common technology used in semiconductor wafer processes to create the circuitry between the transistors on a chip. After depositing a dielectric to create the circuitry pattern on the wafer, dual damascene copper is used to fill the trenches and create the interconnects.
As the semiconductor industry continues to shrink technology nodes, it relies on dual damascene copper to meet tight requirements to achieve finer feature sizes in the circuitry, in accordance with Moore's Law. Today's dual damascene copper material needs to: