Electronic Components


Metal Finishing for Electronic Components

Expert metal finishing to ensure reliable component performance

DuPont brings expertise to all aspects of metal finishing, ensuring the reliable performance of all electronic component types. Metal finishing involves multiple steps, and DuPont understands how all the various plating and coating materials interact.

We combine our materials science knowledge with a vast library of metal plating chemistries to guide customers toward the best choice for their application. Solutions cover:

  • Metal plating of contacts for improved functionality
  • Surface treatment to modify surfaces for better adhesion between layers
  • Protection of plated metal surfaces for long-term corrosion resistance

Choose DuPont as your materials solutions partner to:

  • Understand the demands of your end market regarding reliability, throughput, and cost
  • Provide a holistic, seamless solution so your components can perform as designed
  • Work with you to select the ideal combination of materials and treatments
  • Electronic components are proliferating in automotive applications, where reliability is especially critical. For datacom/telecom as well as consumer electronics, component miniaturization brings another set of challenges as package dimensions shrink and contact spacing decreases. Migration to 5G networks with higher data transmission rates and high-frequency operation puts additional demands on components.

  • Supporting these industry trends require metal finishing materials that ensure excellent component performance in a variety of environments. When optimized for each application, metallization and surface treatments enhance the reliability and functionality of electronic components.

Electronic Components

  • Connectors


    Expert Metal Finish Solutions for Connectors

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    • Ancillaries for Connectors

    Pre-and-post treatment products that enhance the performance of Connectors parts

    • Bright and Matte Tin Electroplating Products for Connectors

    A complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts

    • Gold and Gold Alloy Electroplating Products for Connectors

     Innovative technologies that enable higher productivity, better functionality and stronger sustainable developments

    • Indiplate™ Indium

    Advanced Indium electroplating technologies that enhance the reliability of interconnections for connector parts

    • Nickel and Nickel Alloy Electroplating Products

    Electrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growth

    • Palladium and Palladium Alloy Electroplating Products

    Electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance

    • Silver and Silver Alloy Electroplating Products for Connectors

    Innovative cyanide-free electrolytic silver products that reduce or replace gold plating

    • Solderon™ BHT-350 Bright Tin for Connectors

    A high-speed, sulphonate-based tin electroplating product that provides bright deposits over a wide current density range
  • Leadframes


    Tailored metal plating solutions to enhance leadframe performance and component reliability.

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    • Ancillaries for IC Leadframes

    A family of pre-and-post treatment products that enhance the performance of IC leadframes parts

    • High Speed Silver Electroplating Products for IC Leadframes

    High purity electrolytic silver jet plating products for the IC leadframe market

    • Matte Tin Electroplating Products for IC Leadframes

    A complete family of electrolytic tin products that enhance functionality with reduced cost of ownership

    • Nickel, Palladium, and Gold Electroplating Products for IC Leadframes

    Advanced electrolytic nickel, palladium and gold products for pre-plated frames application

    • Silverjet™ High Brightness Silver

    A high brightness silver electrolytic finish for leadframes that enable high performance LED packages

    • Solderon™ ST-300T Matte Tin

    Enabling high-throughput for maximum cost benefit while delivering exceptional performance

    • Surface Treatment for IC Leadframes

    Advanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth
  • Passive Devices

    Passive Devices

    Ensuring Reliable Connections for All Passive Devices

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    • Copper Electroplating Products for Passive Devices

    A range of electrolytic copper plating products designed for plating of passive devices

    • Nickel Electroplating Products for Passive Devices

    Advanced electrolytic nickel plating products for Passive Devices that enhance corrosion resistance

    • Tin and Tin-Alloy Electroplating Products for Passive Devices

    Leading electrolytic tin products that meet the needs of passive devices
  • Tape Automated Bonding

    Tape Automated Bonding

    Immersion tin for TAB and COF manufacturing.

    • Ancillaries for TAB/COF

    Supporting products for pre-and-post treatment to enhance the performance of the TAB/COF products

    • Immersion Tin Products for TAB/COF

    Immersion tin products providing exceptional performance with low running cost