Electronic Components


Process Solutions for Electronic Components

Process solutions and knowhow to ensure reliable component performance

DuPont brings expertise to all aspects of component finishing, ensuring the reliable performance of electronic components and systems. 

We combine our materials science knowledge with a vast portfolio of plating chemistries to guide customers toward the best choice for their application. Solutions cover:

  • Process solutions for reliable soldered or press-fit connections
  • Surface treatment to enhance adhesion between layers
  • Novel finishes for enhanced contact quality
  • Protection of plated metal surfaces for long-term corrosion resistance
  • Accurate metal placement is enabled with state-of-the-art imaging processes, providing a total process solution and minimizing non-value-added plating 

Choose DuPont as your materials solutions partner to:

  • Understand the demands of your end market regarding reliability, throughput, and cost
  • Provide a holistic, seamless solution so your components can perform as designed
  • Work with you to select the ideal combination of materials and treatments
  • Electronic components are proliferating in automotive applications, where reliability is especially critical. For datacom/telecom as well as consumer electronics, component miniaturization brings another set of challenges as package dimensions shrink and contact spacing decreases. Migration to 5G networks with higher data transmission rates and high-frequency operation puts additional demands on components.

  • Supporting these industry trends requires component finishing materials and knowhow that ensure excellent component performance in a variety of environments. When optimized for each application, metallization and surface treatments enhance the reliability and functionality of electronic components.

Electronic Components

  • Connectors


    Process solutions for Electronic Connector Finishing

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    • Ancillaries for Connectors

    Pre-and-post treatment products that enhance the performance of Connectors parts

    • Bright and Matte Tin Electroplating Products for Connectors

    A complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts

    • Gold and Gold Alloy Electroplating Products for Connectors

     Innovative technologies that enable higher productivity, better functionality and stronger sustainable developments

    • Indiplate™ Indium

    Advanced Indium electroplating technologies that enhance the reliability of interconnections for connector parts

    • Nickel and Nickel Alloy Electroplating Products

    Electrolytic nickel plating products for the Connector market that enhance corrosion resistance and inhibit tin whisker growth

    • Palladium and Palladium Alloy Electroplating Products

    Electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance

    • Silver and Silver Alloy Electroplating Products for Connectors

    Innovative cyanide-free electrolytic silver products that reduce or replace gold plating
  • Leadframes


    Sustainable total process solutions for high reliability and enhanced process efficiency

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    • Ancillaries for IC Leadframes

    A family of pre-and-post treatment products that enhance the performance of IC leadframes parts

    • Matte Tin Electroplating Products for IC Leadframes

    A complete family of electrolytic tin products that enhance functionality with reduced cost of ownership

    • Nickel, Palladium, and Gold Electroplating Products for IC Leadframes

    Advanced electrolytic nickel, palladium and gold products for pre-plated frames application

    • Silver Electroplating Solutions

    High purity electrolytic silver jet plating products for the IC leadframe market

    • Silverjet™ High Brightness Silver

    A high brightness silver electrolytic finish for leadframes that enable high performance LED packages

    • Surface Treatment for IC Leadframes

    Advanced surface treatment material that reduce silver immersion, minimize epoxy bleed, and inhibit tin whisker growth
  • Passive Components

    Passive Components

    Ensuring Reliable Connections for All Passive Devices

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    • Copper Electroplating Products for Passive Components

    A range of electrolytic copper plating products designed for plating of passive components

    • Nickel Electroplating Products for Passive Components

    Advanced electrolytic nickel plating products for Passive Components that enhance corrosion resistance

    • Tin and Tin-Alloy Electroplating Products for Passive Components

    Leading electrolytic tin products that meet the needs of passive components
  • Tape Automated Bonding

    Tape Automated Bonding

    Immersion tin for TAB and COF manufacturing.

    • Ancillaries for TAB/COF

    Supporting products for pre and post treatment to enhance the performance of the TAB/COF products.

    • Immersion Tin Products for TAB/COF

    Leading immersion tin products providing exceptional performance with low running cost.