Thick film on steel substrates bring with them the advantages of low thermal mass, meaning quicker-heat up rate, improved controllability and therefore economy to the customer.

DuPont LS series laser structurable metallization pastes provide enhanced fine line capabilities through laser ablation, offering superior resolution to screen printing with sub-100 micron pitch.

Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.

DuPont offers the widest variety of thick film dielectrics for cross-overs, co-fireable and sequentially fired multilayer applications, including encapsulants and UV-curable polymer thick film (PTF) compositions.

DuPont AS series screen printable pastes are designed for creating circuitry directly onto aluminum substrates and heat sinks. The AS series paste is suitable for all applications requiring optimum thermal management such as LED lighting and power circuits.

The innovative Fodel™ system from DuPont is a complete photo defined thick film ceramic system, featuring silver and gold conductors and multilayer dielectric materials.