DuPont is a leading supplier of thick film hybrid circuit materials for advanced electronic applications worldwide.
We offer the broadest selection of hybrid circuit materials, providing high reliability across different substrates, operating environments, temperatures, and metallizations. Our extensive offering consists of material systems with proven compatibility including a full line of conductors, dielectric materials, resistor materials, encapsulants, and Fodel® photoimageable materials.
DuPont’s hybrid circuit materials are relied upon every day in satellite communications, automotive electronics, guidance systems, aerospace, defense/homeland security, telecommunications, and consumer electronics.
DuPont is a leading supplier of thick film resistor materials for use in hybrid applications including chip resistors and networks.View Details
Thick film on steel substrates bring with them the advantages of low thermal mass, meaning quicker-heat up rate, improved controllability and therefore economy to the customer.View Details
DuPont LS series laser structurable metallization pastes provide enhanced fine line capabilities through laser ablation, offering superior resolution to screen printing with sub-100 micron pitch.View Details
Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.View Details
DuPont offers the widest variety of thick film dielectrics for cross-overs, co-fireable and sequentially fired multilayer applications, including encapsulants and UV-curable polymer thick film (PTF) compositions.View Details
DuPont AS series screen printable pastes are designed for creating circuitry directly onto aluminum substrates and heat sinks. The AS series paste is suitable for all applications requiring optimum thermal management such as LED lighting and power circuits.View Details
The innovative Fodel™ system from DuPont is a complete photo defined thick film ceramic system, featuring silver and gold conductors and multilayer dielectric materials.