Thick Film Materials
Hybrid Circuit Materials
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Thick Film Hybrid Circuit Materials
DuPont is a leading supplier of thick film hybrid circuit materials for advanced electronic applications worldwide.
We offer the broadest selection of hybrid circuit materials, providing high reliability across different substrates, operating environments, temperatures, and metallizations. Our extensive offering consists of material systems with proven compatibility including a full line of conductors, dielectric materials, resistor materials, encapsulants, and Fodel® photoimageable materials.
DuPont’s hybrid circuit materials are relied upon every day in satellite communications, automotive electronics, guidance systems, aerospace, defense/homeland security, telecommunications, and consumer electronics.
Hybrid Circuit Materials
- Thick Film Resistor Materials
- Heatel™ Thick Film Pastes
- Laser Structurable Pastes
- Conductive Materials for Hybrid Circuits
- Dielectric & Encapsulant Materials
- AS Series Paste System for Aluminium
- Fodel™ Photoimigeable Pastes
Thick Film Resistor Materials
DuPont is a leading supplier of thick film resistor materials for use in hybrid applications including chip resistors and networks.
View DetailsHeatel™ Thick Film Pastes
Thick film on steel substrates bring with them the advantages of low thermal mass, meaning quicker-heat up rate, improved controllability and therefore economy to the customer.
View DetailsLaser Structurable Pastes
DuPont LS series laser structurable metallization pastes provide enhanced fine line capabilities through laser ablation, offering superior resolution to screen printing with sub-100 micron pitch.
View DetailsConductive Materials for Hybrid Circuits
Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.
View DetailsDielectric & Encapsulant Materials
DuPont offers the widest variety of thick film dielectrics for cross-overs, co-fireable and sequentially fired multilayer applications, including encapsulants and UV-curable polymer thick film (PTF) compositions.
View DetailsAS Series Paste System for Aluminium
DuPont AS series screen printable pastes are designed for creating circuitry directly onto aluminum substrates and heat sinks. The AS series paste is suitable for all applications requiring optimum thermal management such as LED lighting and power circuits.
View DetailsFodel™ Photoimigeable Pastes
The innovative Fodel™ system from DuPont is a complete photo defined thick film ceramic system, featuring silver and gold conductors and multilayer dielectric materials.
View Details