Steel Mill

Dow Electronic Materials offers a line of tinplate processes that are used to deposit tin metal on steel sheet moving at very high speed in vertical or horizontal lines at a tin mill operation. These process components and electrolyte control plating range include grain refinement, brightness, uniformity, sludge formation and fluxing.

Tin-Plate

Dow Electronic Materials’ tinplate processes are suitable for vertically and horizontally oriented lines, soluble and insoluble anodes, isolated-fluxing and self-fluxing applications. The electrolyte is highly conductive, non-toxic with a low COD and designed to be able to operated in a closed-loop fashion with no emissions.

RONASTAN™ TP-G7 Electrotinning Solution