Dow Electronic Materials offers a line of tinplate processes that are used to deposit tin metal on steel sheet moving at very high speed in vertical or horizontal lines at a tin mill operation. These process components and electrolyte control plating range include grain refinement, brightness, uniformity, sludge formation and fluxing.
Dow Electronic Materials’ tinplate processes are suitable for vertically and horizontally oriented lines, soluble and insoluble anodes, isolated-fluxing and self-fluxing applications. The electrolyte is highly conductive, non-toxic with a low COD and designed to be able to operated in a closed-loop fashion with no emissions.
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