Seminar Agenda - Printed Electronics Technology

 
 
 

Seminar Agenda & Session Overviews

October 29 - 30, 2019

DAY 1 TUESDAY, OCTOBER 29, 2019
7:45am Coffee
8:00am Welcome & Introduction to PVAM
8:30am - Introduction to printed electronics technology 
The development of printed electronics technology is described with reference to the early applications which it was initially used for including Membrane touch-switches, EL (electroluminescence) and bio-medical.
9:00am - Paste Manufacturing process
The thick film composition is broken down into individual components such as metal powder, vehicles and solvents. We show how each component is manufactured, types of industrial equipment used, and how they are QC tested and controlled for quality and consistency.
10:00am BREAK

10:15am - Carbon Conductors & Resistors
These materials are primarily carbon based and are used in applications requiring conductive or resistive performance, wear resistance and heating capability. The key electrical and mechanical properties are described for currently available products

10:45am - Non-Conductive Dielectrics/Encapsulants
These materials are used to provide insulation in conductor cross-overs and to provide encapsulation for environmental protection. The various material options and their properties are described.
11:15am – PTF Conductors
Conductors are the key functional component of printed electronics and are used for conductive tracks, termination pads, electrodes, antennae and many other functions and are mainly based on Ag, but Cu, ITO and other metals are also used for specific applications. 
11:45am LUNCH 
12:45pm - Printed Electronics processing – screen printing and drying/curing process and alternatives to screen printing
“Best practices” are discussed in detail to select the proper screen, mesh, emulsion, squeegee, print speed, printer setup, etc., ultimately to help improve control of thick film deposition. This section provides a thorough understanding of the printing process to enable one to troubleshoot and solve printing problems.  The drying/curing process is also a critical step and the different types of drying process and equipment are described with recommendations on how to setup for optimum properties.  In addition, some alternative deposition techniques such as inkjet, dispensing and gravure are described.
2:15pm BREAK

2:30pm - Testing of printed electronics materials  
Test methods for measuring electrical, physical and mechanical properties of processed parts are described along with recommendations for suitable equipment and materials.

3:00pm - Lab Tour 1
Processing: Large format printer set-up and processing, belt dryer processing and profiling; In-Mold thermoforming; Wearables lamination and singulation
5:30pm Cocktails and Dinner
DAY 2 WEDNESDAY,  OCTOBER 30, 2019
Printed Electronics applications
The following sessions review some the most important applications where printed electronics materials can be used. The available pastes and processing specific to these applications will be described in detail.
8:00am Coffee
8:15am - In–Mold Electronics                       
This technology allows circuitry to be integrated with switches and components in molded 3D substrates to provide reduced cost, lower profile and improved aesthetic appearance.
9:15am - Wearables
Technology for integrating circuitry into garments that are resistant to washing and mechanical stretching. Applications include monitoring, medical, heating and point of sale.

10:00am - RFID antennae & Thin Film PV
High conductivity inks are required for antennae for use in smart cards and documents, tracking and point of sale. Low temperature technologies including CIGS, TCO and HJT used for photovoltaic cell manufacture are described.   

10:30am BREAK

10:45am - Heaters
This application uses carbon-based PTC pastes to print self-limiting heaters
11:15pm - Very low temp materials & Inkjet 
In applications that use sensitive substrates specially modified paste are required to allow ultra-low curing temperatures as low as 60°C to be used. Use of substrates like PCB or KAPTON allow use of high curing temperature up 200°C and enable higher conductivity and the option to solder.
11:45pm - LUNCH

12:45pm - Flex & Rigid - High Temperature Applications
Use of substrates like PCB or KAPTON allow use of high curing temperature up 200°C and enable higher conductivity and the option to solder.

1:30pm - Laboratory tours/demonstrations 2
Testing: Pencil hardness, Crease Resistance, Tape Adhesion, Automated stretch and crease, Laser ablation and Screen prep.

3:30pm - Wrap-up and Adjourn
 
 
 
 
 
 

A DuPont Representative will contact you to confirm your attendance and detailed information regarding lodging.

 
 
 
 
 
 
 
 
 

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