Dow Electronic Materials offers a complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts.
SOLDERON™ BT-280 Semi-Bright to Bright Tin
Description: High-speed, pure tin plating product formulated for superior brightness and solderbility with low carbon content in the deposit and low whisker propensity.
SOLDERON™ BHT-350 Bright Tin
Description: High-speed, pure tin plating product customized for room temperature to elevated temperature operation.
SOLDERON™ ST-200 Matte Tin
Description: Matte tin deposits with very low whisker propensity and board working window.
SODLERON™ ST-300T Matte Tin
Description: A single additive matte tin product that offers excellent leveling, wide operating window with outstanding functional performance.