As HDI designs, especially those incorporating every layer interconnect (ELIC) technology to enable increasing functionality become more common in today’s mobile devices, tablets, and wearables, the demands on interconnect density and reliability are continuously challenged.
To meet these challenges, Dow has created the CIRCUPOSIT 6500 Horizontal Electroless Copper System, based on an Ionic Catalyst and a Tartrate-based Electroless copper for ELIC and IC Substrate applications.
Key Features of the process:
CIRCUPOSIT 6530 Catalyst Process for Electroless Copper Metallization
Read Technical Paper
Ionic Palladium Catalyst Process for Electroless Copper Metallization
Perfect grain transfer from plated copper to target pad, with no demarcation line. Meets reliability requirements.
Full electroless Cu coverage and high throwing power in blind vias
Excellent dielectric coverage for different applications