IC Substrate

Circuposit™ 7900 Electroless Copper for SAP

Circuposit™ 7900 Electroless Copper Process has been specifically developed for SAP applications. The new Circuposit™ SAP Conditioner provides uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials.

Key Benefits:

  • Fine deposit grain structure
  • Excellent electroless copper coverage including in microvias
  • Excellent peel strength after HAST & Reflow
  • Uniform thickness
  • Excellent via reliability
  • High migration resistance
  • Excellent bath stability
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Fine Grain Structure

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Excellent Via Bottom Coverage

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10um L/S after flash etch