DuPont offers a complete set of conductors covering a broad application spectrum.
Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.
The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.
Conductors for alumina substrates from DuPont include:
These conductors are co-fireable or sequentially fireable.
In addition, DuPont conductors for glass substrates offer these benefits: