DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces through our EKC Technology portfolio.
EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.
EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.
EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.
EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.View Details
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.View Details
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contactsView Details
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printingView Details
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.View Details