Photoresist Removers

DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces through our EKC Technology portfolio.

EKC Photoresist Remover Portfolio:

Posistrip® Removers

EKC800™
EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.

EKC830™
EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.

EKC865™
EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.

Universal Removers

EKC922™
EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.

Photoresist & Residue Removers

  • Photoresist Removers

    Photoresist Removers

    Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces

  • Post-Etch Residue Removers

    Post-Etch Residue Removers

    Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

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  • Post-CMP Cleaners

    Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

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  • Removers for LED Fabrication

    Removers for LED Fabrication

    Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts

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  • WLP Photoresist Removers & TSV Cleaners

    WLP Photoresist Removers & TSV Cleaners

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing

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  • Post-Clean Treatments

    Post-Clean Treatments

    Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

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