EKC® Specialized Removers and Clean Chemistries

Post-CMP Cleaners

 
 
 

Post-CMP Cleaners

Chemical mechanical planarization (CMP) is a critical enabling technology in advanced integrated circuit manufacturing. Defects and residues either deposited or formed during the planarization process that can adversely affect product yield are subsequently removed in the post-CMP cleaning step. Aqueous formulations employed for post-CMP (PCMP) cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

DuPont’s PCMP offerings are part of our EKC Technology portfolio.

DuPont™ EKC® PCMP5600 Series Post-CMP Copper Interconnect Cleaners

DuPont™ EKC® PCMP5600 Series is a high volume, post-CMP copper interconnect cleaner required in the manufacturing of advanced semiconductor devices. It features high pH formulations for Cu BEOL and can be used with various barrier slurries.

It offers the following capabilities: 

  •  Excellent particle removal capability
  • Advanced barrier metals and dielectric compatibility, including Co, and Ru
  • Compatible with ULK dielectrics
  • Improved Cu static etch and lower surface roughness
  • Contains Copper Oxidation Barrier (COB) functionality
  • Excellent capability to remove BTA and other organics
  • TMAH free
  • Enhanced cost-of-ownership with high dilution design

EKC® PCMP5610/ PCMP5620 offers a manufacturing-proven, low cost-of-ownership copper post-CMP cleaner featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films; and can be used with advanced barrier films with excellent corrosion resistance. EKC® PCMP5610/ PCMP5620 offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules.

EKC® PCMP5615 is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post-CMP cleaner featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films; compatible with Co, and Ru applications, prevents the formation of circular ring defects. EKC® PCMP5615™ offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules.

EKC® PCMP5650 is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post-CMP cleaner featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces, offers enhanced compatibility with sensitive low-k and ULK films, prevents the formation of circular ring defects, and is compatible with Co and Ru applications, EKC® PCMP5650 was specially designed for technology below 14nm, where organic defects control and minimal Cu and Co corrosion are required. EKC® PCMP5650 is also a highly concentrated chemical to meet low cost-of-ownership targets for all equipment cleaning modules.

 

DuPont™ EKC® PCMP3200 Series Post-CMP Tungsten Interconnect Cleaners

DuPont™ EKC® PCMP3200 series are high volume, post-CMP Tungsten interconnect cleaners for the manufacturing of advanced semiconductor devices, both for BEOL and middle-end-of-line (MEOL) applications. such as Co and TiN.

EKC® PCMP3210 offers a manufacturing-proven, low cost-of-ownership post-CMP cleaner featuring an alkaline pH formulation for W CMP. This single chemistry solution is compatible both W and Co, and provides very low defectivity on TEOS or Silicon nitride films. PCMP3210 also incorporates dissolution agents for TiO2 debris originating from TiN barriers. PCMP3210 offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules.

 

DuPont™ EKC® PCMP2100 Series Post-Ceria Slurry CMP Cleaners

DuPont™ EKC® PCMP2100 is a new series of cleaners designed for cleaning semiconductor wafers after use of ceria CMP slurries required in FEOL, MEOL and memory array layers.

EKC® PCMP2110 offers a manufacturing-proven, low cost-of-ownership post-CMP cleaner featuring an acidic pH formulation for use after ceria slurries. This single chemistry solution is designed to clean ceria slurry particles, as well as minimizing residual cerium ions post-CMP. It is designed to use with conventional ceria slurries, as well as the newest ceria slurries, with particles either positively or negatively charged. PCMP2110 offers the capability to eliminate post-CMP wet bench cleans, such as SPM or HF.

 
 
 

Specialized Removers and Clean Chemistries

  • Post-CMP Cleaners

    Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.

  • Post-Etch Residue Removers

    Post-Etch Residue Removers

    Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

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  • EKC® Strippers & Rinses

    EKC® Strippers & Rinses

    Strippers to remove photoresist used during the lithography process

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