Kapton® EN, high modulus polyimide film

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects.  Kapton® EN is   the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to   copper. 

Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer.

The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film.  Kapton® EN   film also has very low moisture absorption and is laser ablatable.

Applications include:

• Flexible printed circuits
• Fine pitch circuitry
•  Chip scale packaging
• High density interconnects

Typical Properties for DuPont™ Kapton® EN Polyimide Film