Kapton® XP insulation substrate

Kapton® type XP provides a type H film coated on one or both sides with a proprietary fluorocarbon resin which provides excellent mechanical strength and adhesive properties at elevated temperatures.

In addition, high level bond strengths of XP to copper, itself or other materials are maintained at elevated temperatures. The four graphs included in the technical data sheet (downloadable file) compare retention of bond strength of type FN and type XP from room temperature to 200°C.

Kapton® XP exhibits the same chemical stability, electrical properties, and mechanical strengths in high and low temperature environments as has been demonstrated with Kapton® FN.

Availability Both 2 mil Kapton® XP (919) and 1.5 mil XP (019) are in inventory. Other constructions can be made available as market applications and needs develop. Substrate preparation and electrical, mechanical and chemical data can be found in the Kapton® Summary of Properties booklet (EI-10142). 

ELECTRICAL PROPERTIES OF Kapton® XP

PROPERTY

UNIT

150XP019

200XP919

TEST METHOD

Thickness

mil

µm

1.5

38

2.0

50

ASTM D374

Tensile Strength

kpsi

MPa

29

200

24

165

ASTM D882

Elongation

%

93

95

ASTM D882

Dielectric Stregth

V/mil

kV/mm

4400

173

4800

189

ASTM D149

Yield

ft2/lb

m2/kg

82.4

16.9

57.4

11.8

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