Microfill™ EVF Via Fill provides enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses. Formulated to operate in existing equipment over a broad range of operating conditions, this plating bath is suitable for both HDI and IC substrate applications.
Key Benefits:
100µm dia x 60µm deep,
12µm surface copper
70µm dia x 35µm deep,
15µm surface copper
150µm dia x 100µm deep,
20µm surface copper
0.15mm dia x 1.0mm deep,
20µm surface copper