Microfill™ EVF Via Fill provides enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses. Formulated to operate in existing equipment over a broad range of operating conditions, this plating bath is suitable for both HDI and IC substrate applications.

Key Benefits:

• Low plating thickness (20 µm)
• Simultaneous microvia filling and through-hole plating
• Easy analytical procedure by conventional CVS
• Rectangle trace profile for wire bond application
• Compatible with both soluble and insoluble anodes
• Excellent reliability