DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
Specifically formulated with FEP fluoropolymer film and DuPont™ Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance.
Copper Clad Features:
DuPont™ Pyralux® TK bondply composites are constructed of DuPont™ Kapton® polyimide film coated on both sides with a fluoropolymer adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® and a layer of adhesive in low count multilayer constructions.