Dry Film Photoresist

Riston® YieldMaster® Wet Lamination Technology

 
 
 

Riston® YieldMaster® Wet Lamination Technology

 

YieldMaster® Technology is a DuPont unique technology to deliver optimum yields through the use of a specially developed thin resist, lamination system, and the proven six sigma approach to defect reduction and equipment design. The superior conformation and high productivity this process allows gives you the finest features at high yield, with less waste and chemical consumption.

Why Choose YieldMaster®?  

  • Laminate faster, increase productivity 
  • Laminate colder,  and avoid pre-heater
  • Better conformation,  better nick/open yield
  • Better adhesion on smooth surface
  • Better adhesion on white metals
 
 
YieldMaster® Technology Series Includes:

YieldMaster® Technology

1ST generation YieldMaster® Technology.  Through a cooperative agreement, DuPont will provide the YieldMaster® system equipment for your use at no cost to you, including professional installation, process implementation, training and resist specification. In return, you agree to basic system maintenance, data recording to document your yield improvements, and compliance with the YieldMaster® resist specifications.

YieldMaster® Advance Technology

2ND  generation YieldMaster® Technology. Through a cooperative agreement, DuPont will provide the YieldMaster® Advance system equipment for your use at no cost to you, including professional installation, process implementation, training and resist specification. In return, you agree to basic system maintenance, data recording to document your yield improvements, and compliance with the YieldMaster® Advance resist specifications and YieldMaster® lamination fluid.

Features:

  • Excellent surface wetting
  • Compatible with anti-tarnish treated copper surface without micro-etching
  • Wider operation window from better compatibility
  • Further enhance conformation and adhesion to enable thinner photoresists
  • Workable from low to high lamination temperature