High Density Interconnect

Ronastan™ EC-1 NPE Free Electrolytic Tin

 
 
 

Ronastan™ EC-1 is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™ EC-1 deposits are designed for use as etch resists in the manufacture of printed circuit boards, where the process shows excellent throwing power and metal distribution, even in high-aspect through holes and microvias…

Key Benefits:

  • Excellent Stability
  • Consistent performance
  • NPE-Free formulation
  • Minimal attack on dry film resists
  • Complete analytical control

What Materials do you need?

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