High Density Interconnect
Ronastan™ EC-1 NPE Free Electrolytic Tin
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Ronastan™ EC-1 is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™ EC-1 deposits are designed for use as etch resists in the manufacture of printed circuit boards, where the process shows excellent throwing power and metal distribution, even in high-aspect through holes and microvias…
Key Benefits:
- Excellent Stability
- Consistent performance
- NPE-Free formulation
- Minimal attack on dry film resists
- Complete analytical control