Passive Devices

Solderon™ SN-2680 Neutral pH Tin


Solderon™ SN-2680 Electrolytic Tin provides a pure tin deposit offering excellent solderability for Passive Devices.


  • Low attack on base ceramic or low-melting point glass due to neutral pH range operation.
  • Excellent solderability.
  • Low propensity for whiskers.
  • No generation of Sn4+ precipitate.
  • Control of product coupling and media aggregation.
  • Use of Flow-Through Platers is achieved due to low foaming formulation when using Solderon™ SN-2680BS

Surface Morphology by SEM (X 50)

Surface Morphology by SEM (X 2,000)


Forming Test

Solderability Test (After PCT)