Passive Devices

Tin and Tin-Alloy Electroplating Products for Passive Devices

DuPont Electronic Solutions offers leading electrolytic tin products

Products

Ronastan™ NT-507 Tin
Description: Produces uniform matte deposit of pure tin from an organic sulfonate electrolyte in barrel and rack applications for pH-sensitive chip parts using an inorganic brightener system.

Ronastan™ NT-925 Tin
Description: Produces a uniform matte deposit of pure tin from an organic sulfonate electrolyte in barrel and rack applications for pH-sensitive chip parts.

Solderon™ LG-M1 Tin
Description: Produces matte pure tin deposits onto terminals of electronic components containing pH sensitive materials. Designed for both barrel and rack applications, providing excellent solderability.

Solderon™ SG-J Tin
Description: Produces a uniform matte deposit of pure tin for pH-sensitive chip parts from a stable organic sulfonate electrolyte in barrel and rack applications.

Solderon™ SN-2680 Tin
Description: A neutral pH electrolytic matte tin plating product designed for barrel, rack and flow-through platers, providing excellent solderability and low twinning.

Passive Devices

  • Tin and Tin-Alloy Electroplating Products for Passive Devices
  • Nickel Electroplating Products for Passive Devices
  • Copper Electroplating Products for Passive Devices

Tin and Tin-Alloy Electroplating Products for Passive Devices

Leading electrolytic tin products that meet the needs of passive devices

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Solderon™ SN-2680 Neutral pH Tin

Providing a pure tin deposit with excellent solderability for Passive Devices


Nickel Electroplating Products for Passive Devices

Advanced electrolytic nickel plating products for Passive Devices that enhance corrosion resistance

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Copper Electroplating Products for Passive Devices

A range of electrolytic copper plating products designed for plating of passive devices

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