Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Electronics & Imaging Director of Global Display Technology R&D Participates in Panel at 2018 China Display Technology Conference

Nov 01, 2018

At the 2018 China Display Technology Conference, Display Technologies executive Kathleen O’Connell sat on a panel of industry experts.

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Display Technologies Specialty Silicones Team Shares Solutions at Guangzhou International Lighting Exhibition

Aug 09, 2018

At the 2018 Guangzhou International Lighting Exhibition, Dow Display Technologies Specialty Silicones Team exhibited solutions for chip-scale packaging.

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Dow Expert Presents Innovative CSP LED Material Solution to Epistar

May 20, 2018

Leveraging Dow’s expertise in LED materials, Epistar has partnered with us to extend its LED package manufacturing business to integrate chip-scale packages (CSPs) LED packaging. This partnership will present new solutions for LEDs and beyond.

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Extending OLED Device Lifetimes

Apr 26, 2018

OLEDs are experience strong market interest, but for even broader adoption, new technology is needed to achieve improvements in efficiency and lifetime. This research examines the effects of the molecular design of molecules within OLEDs and their connection to device lifetime.

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The Present and Future of OLED Materials Development

Oct 13, 2016

At the Global Materials Tech Fair in Seoul, Dow’s senior R&D manager Dai-Kyu Kim, recently delivered a lecture on the present and future of organic light emitting diode (OLED) materials development. Kim addressed the market outlook for OLEDs, including the evolution of OLED displays, and Dow’s contributions to the growth of the overall OLED display industry.

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Addressing Challenges to Enhance OLED Device Performance

Jul 07, 2015

Challenges related to OLED device performance—such as further optimizing lifetime and efficiency—remain. This article looks at recent work exploring the way molecules pack in the glass film during deposition from the gas phase, which may offer a new tool for enhancing device performance.

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