Semiconductor Fabrication and Packaging Materials

Lithography Materials and Services

Lithography Materials and Services

Market-leading Microlithography Materials to Support Advanced Patterning

DuPont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. Our long history in lithography technology includes many industry-first enabling technology innovations. We lead the market in terms of our breadth of offerings, including ArF photoresists, KrF photoresists, i/g line photoresists, and organic bottom anti-reflective coating (BARC) materials.

By collaborating with you to understand your technical challenges, we develop materials solutions to meet them. The more advanced the process, the more critical it is to work in partnership to design specific materials.

DuPont is here to support you with your biggest (and smallest) lithography challenges! 

  • Microlithography, or photolithography, is an imaging technology that is critical to etch steps in semiconductor manufacturing. It is used to transfer circuitry patterns from a photomask to a silicon wafer, after which etch processes complete the pattern.

  • Driven by ubiquitous high-performance, low-power computing needs, the semiconductor manufacturing industry continues to shrink feature sizes to make faster and smaller transistors with higher storage capacity. This requires high-quality and high-performing lithography materials.

Lithography Materials and Services

  • Photoresists
  • Advanced Overcoats
  • Anti-Reflectants & Functional Sublayers
  • Ancillary Lithography Materials
  • Electronic Grade Polymers
  • Metrology & Imaging Services

Photoresists

DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

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ArF Dry Resist

Positive tone ArF (193 nm) dry photoresists optimized for trench and line/space applications

ArF Immersion Contact Hole

Positive tone 193 nm immersion resists with an excellent process window, CD uniformity and low defectivity

ArF Implant Resist

Positive tone 193 nm implant resists with good profile through pitch and excellent substrate compatibility


Advanced Overcoats

Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

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Anti-Reflectants & Functional Sublayers

Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.

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AR™ 10L Bottom Anti-Reflectant Coating

An organic, thermally cross-linking BARC for 248 nm photoresists

AR™ 137 Organic Bottom Anti-Reflectant Coating

An organic bottom anti-reflectant coating (oBARC) for immersion lithography

AR™ 201 Organic Gap Filling Anti-Reflectant Coating

An organic gap filling material for extremely narrow trenches

AR™ 254 Thermally Cross Linking Bottom Anti-Reflectant Coating

An organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist

AR™ Fast Etch Organic Bottom Anti-Reflectant Coatings

A family of cross-linkable BARCs that can etch 30% faster than photoresists


Ancillary Lithography Materials

DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

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Electronic Grade Polymers

DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

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Metrology & Imaging Services

We offer services such as defect testing or patterning wafers

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