CooLam® Thermal Substrates

CooLam® Thermal Substrate for High Brightness LED Lighting

DuPont offers thermally conductive materials which exhibit exceptional reliability under extreme temperatures enabling LED lighting that is brighter, longer lasting, and more cost effective.

DuPont™ CooLam® thermal substrate, made with a proprietary polyimide dielectric specially designed and formulated to be thermally conductive, dissipates heat more rapidly and more reliably than conventional filled epoxy-based boards. With very low thermal impedance, and a maximum operating temperature of up to 180° C, CooLam® thermal substrates help ensure stable performance over a wide range of environmental conditions.

CooLam® thermal substrates are a composite of metal foil and proprietary thermally conductive polyimide dielectric bonded to a metal base or heat sink plate. They provide an ideal thermal substrate for high brightness LED lighting.

Key properties of DuPont™ CooLam® thermal substrates:

  • Low thermal resistance allows more light output at the same current
  • Fewer LEDs achieve the same level of light intensity
  • LEDs run cooler and longer


  • Very low thermal impedance
  • Excellent durability and stability at high temperature
  • UL 94 recognition: V-0
  • Halogen free
  • Lead free solder compatibility
  • RoHS compliant