CooLam® Thermal Substrates

CooLam® Thermal Substrate for High Brightness LED Lighting

DuPont offers thermally conductive materials which exhibit exceptional reliability under extreme temperatures enabling LED lighting that is brighter, longer lasting, and more cost effective.

DuPont™ CooLam® thermal substrate, made with a proprietary polyimide dielectric specially designed and formulated to be thermally conductive, dissipates heat more rapidly and more reliably than conventional filled epoxy-based boards. With very low thermal impedance, and a maximum operating temperature of up to 180° C, CooLam® thermal substrates help ensure stable performance over a wide range of environmental conditions.

CooLam® thermal substrates are a composite of metal foil and proprietary thermally conductive polyimide dielectric bonded to a metal base or heat sink plate. They provide an ideal thermal substrate for high brightness LED lighting.

Key properties of DuPont™ CooLam® thermal substrates:

  • Low thermal resistance allows more light output at the same current
  • Fewer LEDs achieve the same level of light intensity
  • LEDs run cooler and longer

Features:

  • Very low thermal impedance
  • Excellent durability and stability at high temperature
  • UL 94 recognition: V-0
  • Halogen free
  • Lead free solder compatibility
  • RoHS compliant

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VIDEO: For longer lifetime and higher brightness LEDs, Choose DuPont™ CooLam®

DUPONT PRODUCTS & SERVICES

  • CooLam® 3D Thermal Substrate

    DuPont™ CooLam® 3D thermal substrates for bendable metal core printed circuit boards (MCPCBs) are ideal for applications requiring innovative lighting designs directing light output without secondary optics with low thermal impedance and superior electrical performance

  • CooLam® LX Thermal Substrate

    CooLam® LX , designed for high power LED light modules, LED high bay lighting and outdoor LED lighting, where very low thermal impedance is required.

  • CooLam® LA Thermal Substrate

    This material system is designed for today’s demanding thermal applications requiring very low thermal impedance, very high operating temperature, excellent long term reliability, and electri­cal isolation.

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