Pyralux® HT

All Polyimide High Temperature Flexible Laminate System - Pyralux® HT

Pyralux® HT is a complete all polyimide flexible laminate system with the highest service temperature available today.

The Pyralux® HT system has a service temperature of 225°C, the highest service temperature of any flexible circuit material system available today.  Pyralux® HT is the newest product in the broad Pyralux® portfolio, which has been the trusted material used in flexible circuits for more than twenty years.

The Pyralux® HT system is a complete all polyimide flex laminate system that includes a double-sided copper-clad laminate and a unique all polyimide coverfilm or bonding material that becomes a flexible coverlay after processing.  

The bonding material can be used as a coverfilm or as a bonding material for multilayer flex applications.  Offered in a full range of dielectric thicknesses, Pyralux® HT flexible circuit materials provide designers, fabricators, and assemblers a versatile option for a wide variety of flexible circuit constructions.

System Features:

  • >225°C IPC service temperature
  • Excellent thermal resistance
  • UL 94V-0
  • Excellent punching and drilling performance
  • Thin copper clads with superior handling
  • Excellent dielectric thickness tolerance/electrical performance
  • Full compatibility with PWB industry processes
  • High adhesion
  • Halogen-free
  • Low outgassing

Copper Clad Laminate Features:

  • UL maximum operating temperature (MOT) 200°C
  • Low CTE
  • Excellent plated through hole reliability 
  • Excellent moisture and insulation resistance properties
  • Low moisture absorption
  • High tear strength
  • Low outgassing, NASA data available
  • Certified to IPC 4204A/11
  • Available in polyimide thicknesses of 1.0, 2.0, 4.0, and 6.0 mils; others available upon special request
  • Available in RA copper thicknesses of .5, 1.0, and 2.0 oz; thicker copper available upon special request

Bonding Film Features:

  • Able to withstand multiple lamination cycles without degradation
  • Excellent encapsulation and conformation over circuitry
  • Available in thicknesses of 1.5, 2.0, and 3.0 mils
  • Certified to IPC 4203A/24
  • Wide processing latitude
  • No refrigeration required for storage
  • Two-year product performance warranty

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