Pyralux® HT

Pyralux® HT

DuPont™ Pyralux® HT bonding film can be used in conjunction with Pyralux® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after processing. Pyralux® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material performance, and high reliability

Solutions
  • All-Polyimide Solutions
 
 
 

Features & benefits

  • >225°C IPC service temperature
  • Able to withstand multiple lamination cycles without degradation
  • Excellent dielectric thickness tolerance/electrical performance
  • Excellent encapsulation ability
  • Excellent punching and drilling performance
  • Excellent thermal resistance
  • Halogen free
  • High adhesion
  • Low loss characteristics
  • Low outgassing
  • Low resin flow
  • No refrigeration required for storage
  • UL 94V-0
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    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    558 0 0 0
     
     
     
     
     
     
    Product Details

    Fabric/material

    HT CLADS

    Design

    HT0300

    Seam

    HT BONDING FILM

    Packaging

    HT0300

    Hazard

    Coated Material

    HT LAM

    Features

    ADHESIVE

     
     
     
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    Safety Data Sheets(All Languages)
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