Pyralux® TK Copper Clad Laminate and Bonding Film System
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
Specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance.
• Certified to IPC 4203A/13
• Available in dielectric thicknesses of 2, 3, and 4 mils
• Available in copper thicknesses of 12, 18 and 35 microns
• Available in copper types RA, ED
DuPont™ Pyralux® TK bondply composites are constructed of DuPont™ Kapton® polyimide film coated on both sides with a fluoropolymer adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® and a layer of adhesive in low count multilayer constructions.
• No tack for ease of registration
• Excellent encapsulation ability
• Available in thicknesses of 3, 4, and 5.5 mils
• Certified to IPC 4203A/5
The convergence of flex and high-frequency. Take your circuit designs to new heights with increased speed and flexibility.
Product Data Sheets (1)
RELATED DUPONT PRODUCTS & SERVICES
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
Pyralux® JT Coverfilm and Bonding Material is a polyamideimide-based technology for use in rigid-flex applications or higher temperature flex applications.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.
INFORMATION & IDEAS
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications