Pyralux® TK Copper Clad Laminate and Bonding Film System
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
Specifically formulated with Teflon® fluoropolymer film and DuPont™ Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance.
• Certified to IPC 4203A/13
• Available in dielectric thicknesses of 2, 3, and 4 mils
• Available in copper thicknesses of 12, 18 and 35 microns
• Available in copper types RA, ED
DuPont™ Pyralux® TK bondply composites are constructed of DuPont™ Kapton® polyimide film coated on both sides with a fluoropolymer adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® and a layer of adhesive in low count multilayer constructions.
• No tack for ease of registration
• Excellent encapsulation ability
• Available in thicknesses of 3, 4, and 5.5 mils
• Certified to IPC 4203A/5
The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.
Product Data Sheets (1)
RELATED DUPONT PRODUCTS & SERVICES
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
INFORMATION & IDEAS
- DuPont Collaborates with Molex on New High Speed Flexible Interconnects
DESIGN TIP: Pad Only Plating
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
DESIGN TIP: Epoxy Resin Fillets
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
DESIGN TIP: Minimum Bend Radius for Flex Circuits
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
DESIGN TIP: Need for Anchoring Spurs and Pad Fillets
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
DESIGN TIP: Balanced Circuit Pattern Reduces Premature Failure
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
DESIGN TIP: Pad Hold Down Options
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications