Epoxy Adhesive Solutions

Epoxy Adhesive Solutions

DuPont offers a family of epoxy-based adhesive solutions offering superior peel strength, chemical, and heat resistance.

Epoxy materials may provide a cost-effective alternative for many base-level designs not requiring multiple high-temperature lamination cycles.

Epoxy-based Adhesive Solutions include:

Pyralux® HXC black flexible circuit material - DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. 

DuPont offers additional Epoxy-based Adhesive Solutions under the Nikaflex® Brand.

Featured

  • All Polyimide Solutions

    DuPont adhesiveless copper clad flexible laminates (CCL), using high performance Kapton® and Kapton®/Teflon® composite dielectrics, are available in a wide variety of copper types and thickness.

  • Acrylic Adhesive Solutions

    DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.

  • Fluoropolymer Adhesive Solutions

    DuPont offers a family of fluoropolymer adhesive solutions for superior performance in high-speed and high frequency applications.

DUPONT PRODUCTS & SERVICES

  • Pyralux® TK

    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.

  • Pyralux® LF

    DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

  • Pyralux® AP

    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

  • Pyralux® LF-B

    DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.

  • Pyralux® HXC

    DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.

  • Pyralux® FR

    DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

  • Pyralux® AC

    DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

  • Pyralux® PC

    DuPont™ Pyralux® PC 1000 is a modified acrylic flexible photoimagable dry film coverlay used for single and double sided applications that require fine line resolution along with bend and crease flexibility.

  • Pyralux® LG

    DuPont™ Pyralux® LG is an acrylic impregnated glass fabric composite heat sink bonding and stiffener applications.

  • Pyralux® APR

    DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.