Riston® GoldMaster Series Dry Film Photoresist

GoldMaster Dry Film Photoresist for Nickel/Gold Plating Applications

Gold plating had consistently been a problem for the printed circuit board industry until DuPont introduced Riston® GoldMaster.

GoldMaster is a fully aqueous resist that simplifies circuit board fabrication with special plating finishes, including nickel and gold plating, selective solder strip and thick plating.

GoldMaster, available in a 3 and 4 mil thickness, is a high productivity, easy stripping resist that eliminates extra processing steps, such as UV curing and thermal baking, without compromising quality or cost.

Check out GoldMaster on you next demanding gold plating/selective metal plating job.

Contact Us

RELATED DUPONT PRODUCTS & SERVICES

  • Riston® FX Dry Film Photoresist

    DuPont has developed the Riston® FX Series of photoresists to help fabricators address challenges of producing fine lines at high yields.

  • Riston® EtchMaster Series Dry Film Photoresist

    Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.

  • Riston® MultiMaster Series Dry Film Photoresist

    DuPont™ Riston® MultiMaster Series simplifies the manufacturing operation by eliminating the need for different films in your production line.

  • Riston® PlateMaster Series Dry Film Photoresist

    Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate.

  • Riston® TentMaster Series Dry Film Photoresist

    DuPont™ Riston® TentMaster provides excellent tenting capability, outstanding conformation, excellent resolution and remarkable tolerance to off-contact exposure.

  • Riston® Laser Series Dry Film Photoresist

    Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.