Post Clean Treatments
Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
EKC4000™ PCT is a cost effective replacement that outperforms conventional "rinse" chemistries such as IPA and NMP. It quickly and effectively eliminates corrosion on the wafer surface caused by drag-out (carry over) of chemistry from prior wet cleaning. EKC4000™ PCT is compatible with automatic equipment and is formulated to meet ULSI grade specifications for advanced wafer treatment.
Product Data Sheets (1)
RELATED DUPONT PRODUCTS & SERVICES
Post-Etch Residue Removers
Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.
Removers for LED Fabrication
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.
WLP Photoresist Removers & TSV Cleaners
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
INFORMATION & IDEAS
Copper PCMP Cleaning Applications
This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces and more.