Wafer Level Packaging Solutions

Achieve Higher Yields with DuPont Wafer Level Packaging Solutions

DuPont is expanding its offering of integrated solutions for both current and emerging WLP requirements in the semiconductor industry.

WLP solutions for three dimensional and through silicon vias (3D/TSV), bonding, fan out, bumping, pillars and redistribution dielectrics are tested and proven for area array package requirements, whether stencil printed, plated, pillared or C4 applied.

Key benefits of these integrated solutions include higher yields, increased reliability and lower cost of ownership.