Pillars & Bumping

Thick & Thin Dry Film Photoresists to Enable Pillars & Bumping

  • Thin Dry Film Photoresists
    Down to 10 microns, DuPont MX Series thin film photoresists for electroplating, and wet and dry etching of redistribution conductors and UBM’s
  • Thick Dry Film Photoresists
    DuPont WB Series provides consistent, precise patterning using a wide range of metals to form bumps and pillars up to a height of 120 microns