Thick & Thin Dry Film Photoresists to Enable Pillars & Bumping
- Thin Dry Film Photoresists
Down to 10 microns, DuPont MX Series thin film photoresists for electroplating, and wet and dry etching of redistribution conductors and UBM’s - Thick Dry Film Photoresists
DuPont WB Series provides consistent, precise patterning using a wide range of metals to form bumps and pillars up to a height of 120 microns