Kapton® FPC

Kapton® FPC superior adhesion and low shrinkage polyimide film

DuPont™ Kapton® FPC polyimide film is treated on both sides and has the same excellent balance of physical, chemical and electrical properties over a wide temperature range offered by general purpose Kapton® HN.

Kapton® FPC offers superior dimensional stability and adhesion, and is specifically designed for flex circuit manufacturers. In applications where superior adhesion and low shrinkage are important, Kapton® FPC is the polyimide film of choice.

Applications include:

  • Flexible printed circuits
  • Automotive
  • Computers
  • Consumer products
  • Telecommunications equipment
  • Industrial instrumentation and controls
  • Military applications
  • Aerospace
  • Electronic parts
  • PCB stencils
  • Screen printing
  • Insulation tubing
Typical Properties of Kapton® FPC
property 1 mil 2 mil 3 mil 5mil
Dielectric Strength, V/mil 7.700 6,100 5,200 3,900
Coefficient of Thermal Expansion, ppm/°C 20 20 20 20
Adhesion, pli 10 10 10 10
Dimensional Stability, % .03 .03 .03 .03

For complete information on Kapton® FPC, view data sheet.

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