Flexible Circuits

Circuposit™ 200 MLB Process

Circuposit™ 200 Process is a patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.

Circuposit™ MLB Conditioner 211 is an alkaline solvent for the pre-treatment of hole-wall surfaces prior to the use of a permanganate desmear

Circuposit™ MLB Promoter 213 is a replenishable alkaline permanganate bath that effectively removes drill smear and debris wile texturizing remaining resin surfaces to facilitate consistently exceptional coverage, adhesion and joint reliability.

Circuposit™ MLB Neutralizer 216 effectively neutralizes and removes manganese residues from hole-wall surfaces.

Key Benefits:
  • Optimizes resin removal rates across multiple resin systems
  • Removes resin in a controlled and uniform manner
  • Produces a textured resin surface ideal for electroless copper plating
  • Dramatically improves adhesion
  • Fast and effective neutralization
  • Elimination of hole-wall pull away and blow holes
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